컨텐츠 영역
Al Smart Factory
Ⅰ. Display Module Total C/P Line
Glass Loader
Equipment that automatically supplies raw materials or panels at the initial stage of the production process.
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Equipment Size 3,050(W)×1,950 (D)×2,000(H) Applicable Inch 7"~18" Tact Time 9.5sec Supply Method CST 2Port Transfer Unit Transfer Robot
Glass Cleaning Machine
Equipment used in display manufacturing processes to remove dust, particles,
residual organic compounds, and other contaminants from glass substrates.
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Equipment Size 7,460(W)×1,200(D)×2,000(H) Applicable Inch 7"~18" Tact Time 9.5sec Cleaning Method Polishing Disc Post-Cleaning AOI Inspection Line Scan (Top/Bottom), Al Applied Inspection Spec. <50um, <100um, <150um
POL Bonder
Equipment that precisely laminates a thin polarizing film onto a display panel(glass substrate, film)
to control the polarization direction of light.
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Equipment Size 8,800(W)×2,200(D)×2,000(H) Including ME Room: 2,800(D) Applicable Inch 7"~18" Tact Time 9.5sec Attachment Method Roll to Sheet
COG/FOG Bonder
An automated bonding system that precisely aligns ICs and FPCs with the display panel
and joins them through a thermo-compression bonding process.
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Equipment Size 16,800(W)×1,500(D)×2,500(H)
*Including Supply Unit: 2,380(D)Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec
AKKON AOI
Equipment used to inspect the Akkon of D-IC and FPCB at the bonding area of a display panel
and detect cracks that may occur during the bonding process.
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Equipment Size 3,800(W)×1,400(D)×2,200(H) Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec Indentation AOI Inspection Line Scan Method with Displacement Sensor Crack AOI Inspection Line Scan Method with Al
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Optical System
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Crack Inspection
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Indentation Inspection
PCB Bonder
A system that automatically bonds FPC and PCB after high-precision alignment in the display module manufacturing process.
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Equipment Size 2,800(W)×3,090(D)×2,400(H) * Including Supply Unit: 5,730(W) Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec Main Tool 29mm(4ea), 20mm(4ea) ACF Tool 29mm(4ea), 23mm(4ea), Dual Type, Simultaneous Attachment of 2 Panels -
Main tool
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ACF Tool
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Dispenser
An automated system that precisely dispenses solution on the top and bottom surfaces
of the panel and performs curing and inspection processes.
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Equipment Size 3,500(W)×1,500(D)×2,200(H) Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec Coating AOI Line Scan Method (Top/Bottom)
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Coating / Curing / Inspection Module Unit
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Top Surface Inspection
Bottom Surface Inspection
B/A AOI
A process in the final stage of the Display Module manufacturing process that inspects
the driving characteristics and pixel condition of the panel.
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Equipment Size 3,000(W)×3,100(D)×2,200(H) Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec Inspection Unit 2 Station -
Inspection Unit
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Tray Sorting Loader
An automated system that loads finished products onto trays and performs OK/NG sorting
in the display module manufacturing process.
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Equipment Size 4,700(W)×3,100(D)×2,200(H) Panel Size 390mm(W)×250mm(D) Tact Time 9.5sec Tray/Box Common Use -
Tray Supply Unit
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Panel Transfer Stage
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Ⅱ. Al-Based Logistics Automation
SIC RING Automatic Inspection Equipment
OCR Vision Inspection / Automatic Surface Resistance Measurement / Automatic Surface Roughness Measurement (nm-Level)
/ Implementation of Al-Based Logistics Automation
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OCR Inspection
Stylus Automatic Inspection
